PIC16F1824-I/P Microchip Technology, PIC16F1824-I/P Datasheet - Page 11

IC PIC MCU 8BIT 14KB FLSH 14PDIP

PIC16F1824-I/P

Manufacturer Part Number
PIC16F1824-I/P
Description
IC PIC MCU 8BIT 14KB FLSH 14PDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr

Specifications of PIC16F1824-I/P

Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
11
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
14-DIP (0.300", 7.62mm)
Processor Series
PIC16F
Core
PIC
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Watchdog Timer (WDT) ........................................................................................................................................................... 103
11.0 Data EEPROM and Flash Program Memory Control ............................................................................................................... 107
12.0 I/O Ports ................................................................................................................................................................................... 121
13.0 Interrupt-on-Change ................................................................................................................................................................. 141
14.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 145
15.0 Temperature Indicator Module ................................................................................................................................................. 147
16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 149
17.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 163
18.0 SR Latch................................................................................................................................................................................... 169
19.0 Comparator Module.................................................................................................................................................................. 175
20.0 Timer0 Module ......................................................................................................................................................................... 185
21.0 Timer1 Module ......................................................................................................................................................................... 189
22.0 Timer2/4/6 Modules.................................................................................................................................................................. 201
23.0 Data Signal Modulator (DSM) .................................................................................................................................................. 205
24.0 Capture/Compare/PWM Module .............................................................................................................................................. 215
25.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 243
26.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 297
27.0 Capacitive Sensing Module...................................................................................................................................................... 325
28.0 In-Circuit Serial Programming
29.0 Instruction Set Summary .......................................................................................................................................................... 337
30.0 Electrical Specifications............................................................................................................................................................ 351
31.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 383
32.0 Development Support............................................................................................................................................................... 385
33.0 Packaging Information.............................................................................................................................................................. 389
Appendix A: Revision History............................................................................................................................................................. 405
Appendix B: Device Differences ........................................................................................................................................................ 405
Index .................................................................................................................................................................................................. 407
The Microchip Web Site ..................................................................................................................................................................... 415
Customer Change Notification Service .............................................................................................................................................. 415
Customer Support .............................................................................................................................................................................. 415
Reader Response .............................................................................................................................................................................. 416
Product Identification System ............................................................................................................................................................ 417
 2010 Microchip Technology Inc.
Device Overview ........................................................................................................................................................................ 13
Enhanced Mid-Range CPU ........................................................................................................................................................ 21
Memory Organization ................................................................................................................................................................. 23
Device Configuration .................................................................................................................................................................. 51
Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 57
Reference Clock Module ............................................................................................................................................................ 75
Resets ........................................................................................................................................................................................ 79
Interrupts .................................................................................................................................................................................... 87
Power-Down Mode (Sleep) ...................................................................................................................................................... 101
(ICSP
) ................................................................................................................................ 333
Preliminary
PIC16(L)F1824/1828
DS41419B-page 11

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