DSPIC30F6010A-20E/PT Microchip Technology, DSPIC30F6010A-20E/PT Datasheet - Page 178

• Manufacturer Part Number: DSPIC30F6010A-20E/PT
• Description: IC,DSP,16-BIT,CMOS,TQFP,80PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6010A-20E/PT

• Rohs Compliant: YES
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 144KB (48K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-TFQFP
• Package: 80TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 68
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx10-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300019 - BOARD DEMO DSPICDEM 80L STARTERXLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC30F007 - MODULE SKT FOR DSPIC30F 80TQFPDM300020 - BOARD DEV DSPICDEM MC1 MOTORCTRL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

dsPIC30F6010A/6015
24.1
TABLE 24-1:
TABLE 24-2:
TABLE 24-3:
TABLE 24-4:
DS70150D-page 178
dsPIC30F6010A-30I/dsPIC30F6015-30I
dsPIC30F6010A-20E/dsPIC30F6015-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
Note 1:
V
V
(in Volts)
(in Volts)
DD
DD
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
DC Characteristics
4.5-5.5
4.5-5.5
3.0-3.6
3.0-3.6
2.5-3.0
4.5-5.5
4.5-5.5
3.0-3.6
3.0-3.6
2.5-3.0
I
/
INT
O
Junction to ambient thermal resistance, Theta-ja (
Range
Range
=
=
∑
V
(
OPERATING MIPS VS. VOLTAGE FOR dsPIC30F6010A
OPERATING MIPS VS. VOLTAGE FOR dsPIC30F6015
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
D D
{
V
×
D D
(
I
DD
–
V
Characteristic
–
O H
∑
} I
Rating
×
I
O H
Temp Range
Temp Range
OH
-40 to +125
-40 to +125
-40 to +125
-40 to +125
)
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
)
(in °C)
(in °C)
+
∑
(
V
OL
×
I
OL
)
dsPIC30F6010A-30I
dsPIC30F6015-30I
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
30
—
20
—
10
30
—
20
—
10
P
DMAX
θ
θ
θ
P
T
T
T
T
JA
JA
JA
A
A
D
J
J
Min
Typ
Max MIPS
Max MIPS
-40
-40
-40
-40
36
39
39
(T
© 2008 Microchip Technology Inc.
P
J
INT
– T
Max
dsPIC30F6010A-20E
Typ
—
—
—
—
—
—
—
dsPIC30F6015-20E
+ P
A
)/
θ
I
/
O
JA
°C/W
°C/W
°C/W
+125
+150
+125
20
15
20
15
—
—
—
—
—
—
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1