ACS8582 Semtech Corporation, ACS8582 Datasheet - Page 107

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ACS8582

Manufacturer Part Number
ACS8582
Description
Manufacturer
Semtech Corporation
Datasheet
Figure 19 LQFP Package
Thermal Conditions
The device is rated for full temperature range when this package is used with a 4 layer or more PCB. Copper coverage
must exceed 50%. All pins must be soldered to the PCB. Maximum operating temperature must be reduced when the
device is used with a PCB with less than these requirements.
Revision 1.00/March 2008 ©Semtech Corp.
ADVANCED COMMS & SENSING
Package Information
CONFIDENTIAL
FINAL
Page 107
ACS8582
DATASHEET
www.semtech.com

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