lh28f008sc Sharp Microelectronics of the Americas, lh28f008sc Datasheet - Page 21

• Manufacturer Part Number: lh28f008sc
• Description: 8m 1m ? 8 Flash Memory
• Manufacturer: Sharp Microelectronics of the Americas

8M (1M × 8) Flash Memory
Power Dissipation
consider battery power consumption not only during
device operation, but also for data retention during sys-
tem idle time. Flash memory’s nonvolatility increases
usable battery life because data is retained when sys-
tem power is removed.
extremely low power consumption even when system
power is applied. For example, portable computing prod-
ucts and other power sensitive applications that use an
array of devices for solid-state storage can consume
negligible power by lowering RP
modes. If access is again needed, the devices can be
read following the t
quired after RP
istics - Read Only and Write Operations and Figures 16
and 17 for more information.
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings*
Commercial Operating Temperature
Temperature under Bias ...................... -10°C to +80°C
Storage Temperature: ......................... 65°C to +125°C
Voltage On Any Pin
V
V
RP
Output Short Circuit Current .......................... 100 mA
Operating Conditions
SYMBOL
CC
PP
When designing portable systems, designers must
In addition, deep power-down mode ensures
during Read, Block Erase, Byte Write,
and Lock-Bit Configuration ............... 0°C to +70°C
(except V
Byte Write,and Lock-Bit
Configuration ............................ -2.0 V to +14.0 V
during Lock-Bit Configuration
Operations ...............................-2.0 V to +14.0 V
Temperature and V
»
V
V
V
Voltage with Respect to GND
Update Voltage during Block Erase,
T
Supply Voltage ........................... -2.0 V to +7.0 V
CC
CC
CC
A
1
2
3
CC
Operating Temperature
V
V
V
CC
CC
CC
, V
»
is first raised to V
Supply Voltage (3.3 V ± 0.3 V)
Supply Voltage (5 V ± 5%)
Supply Voltage (5 V ± 10%)
PP
PHQV
and RP
CC
PARAMETER
and t
Operating Conditions
»
) ................ -2 V to +7.0 V
PHWL
»
to V
IH
. See AC Character-
wake-up cycles re-
IL
standby or sleep
2, 3
2, 3
1
2
2
4
MIN.
4.75
4.50
3.0
0
products in the design phase of development. Do not
finalize a design with this information. Revised informa-
tion will be published when the product is available.
Veryify with your local SHARP sales office that you have
the latest datasheet before finalizing a design.
*
lute Maximum Ratings” may cause permanent damage.
These are stress ratings only. Operation beyond the
“Operating Conditions” is not recommended and ex-
tended exposure beyond the “Operating Conditions” may
affect device reliability.
NOTES:
1. Operating temperature is for commercial product defined by
2. All specified voltages are with respect to GND. Minimum DC
3. Maximum DC voltage on V
4. Output shorted for no more than on second. No more than one
WARNING: Stressing the device beyond the “Abso-
NOTICE: This datasheet contains information on
this specification.
voltage is -0.5 V on input/output pins and -0.2 V on V
pins. During transitions, this level may undershoot to -2.0 V for
periods < 20 ns. Maximum DC voltage on input/output pins and
V
V
+14.0 V for periods < 20 ns.
output shorted at a time.
CC
CC
is V
+ 2.0 V for periods < 20 ns.
MAX.
5.25
5.50
+70
3.6
CC
+ 5.0 V which, during transitions, may overshoot to
UNIT
°C
V
V
V
PP
and RP
Ambient Temperature
»
TEST CONDITION
may overshoot to
LH28F008SC
CC
and V
21
PP