C8051F365-GM Silicon Laboratories Inc, C8051F365-GM Datasheet - Page 159
![IC 8051 MCU 32K FLASH 28-QFN](/photos/12/27/122713/c8051f365-gm_sml.jpg)
C8051F365-GM
Manufacturer Part Number
C8051F365-GM
Description
IC 8051 MCU 32K FLASH 28-QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051F36xr
Specifications of C8051F365-GM
Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
28-QFN
Core Processor
8051
Core Size
8-Bit
Speed
100MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
25
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F360DK
Minimum Operating Temperature
- 40 C
Package
28QFN
Device Core
8051
Family Name
C8051F36x
Maximum Speed
100 MHz
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1410 - KIT DEV FOR C8051F360 FAMILY
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1647
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F365-GM
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
- Current page: 159 of 288
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15.5. Memory Mode Selection
The external data memory space can be configured in one of four modes, shown in Figure 15.3, based on
the EMIF Mode bits in the EMI0CF register (SFR Definition 15.2). These modes are summarized below.
More information about the different modes can be found in Section “15.6. Timing” on page 160.
15.5.1. Internal XRAM Only
When EMI0CF.[3:2] are set to ‘00’, all MOVX instructions will target the internal XRAM space on the
device. Memory accesses to addresses beyond the populated space will wrap on 1k boundaries. As an
example, the addresses 0x0400 and 0x1000 both evaluate to address 0x0000 in on-chip XRAM space.
•
•
15.5.2. Split Mode without Bank Select
When EMI0CF.[3:2] are set to ‘01’, the XRAM memory map is split into two areas, on-chip space and
off-chip space.
•
•
•
•
EMI0CF[3:2] = 00
On-Chip XRAM
On-Chip XRAM
On-Chip XRAM
On-Chip XRAM
On-Chip XRAM
On-Chip XRAM
8-bit MOVX operations use the contents of EMI0CN to determine the high-byte of the effective address
and R0 or R1 to determine the low-byte of the effective address.
16-bit MOVX operations use the contents of the 16-bit DPTR to determine the effective address.
Effective addresses below the internal XRAM size boundary will access on-chip XRAM space.
Effective addresses above the internal XRAM size boundary will access off-chip space.
8-bit MOVX operations use the contents of EMI0CN to determine whether the memory access is
on-chip or off-chip. However, in the “No Bank Select” mode, an 8-bit MOVX operation will not drive the
upper 8-bits A[15:8] of the Address Bus during an off-chip access. This allows the user to manipulate
the upper address bits at will by setting the Port state directly via the port latches. This behavior is in
contrast with “Split Mode with Bank Select” described below. The lower 8-bits of the Address Bus
A[7:0] are driven, determined by R0 or R1.
16-bit MOVX operations use the contents of DPTR to determine whether the memory access is
on-chip or off-chip, and unlike 8-bit MOVX operations, the full 16-bits of the Address Bus A[15:0] are
driven during the off-chip transaction.
0xFFFF
0x0000
EMI0CF[3:2] = 01
(No Bank Select)
On-Chip XRAM
Figure 15.3. EMIF Operating Modes
Off-Chip
Memory
0xFFFF
0x0000
C8051F360/1/2/3/4/5/6/7/8/9
Rev. 1.0
EMI0CF[3:2] = 10
On-Chip XRAM
(Bank Select)
Off-Chip
Memory
0xFFFF
0x0000
EMI0CF[3:2] = 11
Off-Chip
Memory
0xFFFF
0x0000
159
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