PIC16C781-I/P Microchip Technology, PIC16C781-I/P Datasheet - Page 175

• Manufacturer Part Number: PIC16C781-I/P
• Description: IC MCU OTP 1KX14 W/AD COMP 20DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C781-I/P

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 13
• Program Memory Type: OTP
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 8x8b; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16C
• No. Of I/o's: 16
• Ram Memory Size: 128Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 2
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• On-chip Dac: 8 bit, 1 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMINGDVA16XP202 - ADAPTER DEVICE PIC16C781/782DM163012 - BOARD DEMO PICDEM FOR 16C781/782AC164028 - MODULE SKT PROMATEII 20SOIC/DIP
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC16C781I/P

20-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
2001 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-019
n
eB
E1
E
Dimension Limits
§
2
1
D
c
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
A1
A
MIN
1.025
Preliminary
.140
.115
.015
.295
.240
.120
.008
.055
.014
.310
5
5
INCHES*
B
B1
NOM
1.033
.100
.155
.130
.310
.250
.130
.012
.060
.018
.370
20
10
10
MAX
1.040
.170
.145
.325
.260
.140
.015
.065
.022
.430
15
15
PIC16C781/782
MIN
26.04
3.56
2.92
0.38
7.49
6.10
3.05
0.20
1.40
0.36
7.87
5
5
MILLIMETERS
p
NOM
26.24
2.54
3.94
3.30
7.87
6.35
3.30
0.29
1.52
0.46
9.40
A2
20
10
10
L
DS41171A-page 173
MAX
26.42
10.92
3.68
8.26
6.60
3.56
0.38
1.65
0.56
4.32
15
15