ATSAM3S4AA-MU Atmel, ATSAM3S4AA-MU Datasheet - Page 797

• Manufacturer Part Number: ATSAM3S4AA-MU
• Description: IC MCU 32BIT 256KB FLASH 48QFN
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4AA-MU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 8x10/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-VQFN Exposed Pad, 48-HVQFN, 48-SQFN, 48-DHVQFN
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

35.4
Figure 35-2. Application Block Diagram
35.5
Table 35-1.
Notes:
6500C–ATARM–8-Feb-11
Pin Name
MCCDA
MCCK
MCDA0 - MCDA3
Application Block Diagram
Pin Name List
1. I: Input, O: Output, PP: Push/Pull, OD: Open Drain.
2. When several HSMCI (x HSMCI) are embedded in a product, MCCK refers to HSMCIx_CK, MCCDA to HSMCIx_CDA,
(2)
MCDAy to HSMCIx_DAy.
I/O Lines Description for 4-bit Configuration
Pin Description
Command/response
Clock
Data 0..3 of Slot A
9 1011
1
2 3 4 5 6
ex: File System, Audio, Security, etc.
MMC
1213 8
Application Layer
7
HSMCI Interface
Physical Layer
9
1
2 3 4 5 6
Type
I/O/PP/OD
I/O
I/O/PP
SDCard
(1)
7 8
Comments
CMD of an MMC or SDCard/SDIO
CLK of an MMC or SD Card/SDIO
DAT[0..3] of an MMC
DAT[0..3] of an SD Card/SDIO
SAM3S Preliminary
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