ST7FLITEUS5B6 STMicroelectronics, ST7FLITEUS5B6 Datasheet - Page 105

MCU 8BIT 1KB FLASH 128KB 8-DIP

ST7FLITEUS5B6

Manufacturer Part Number
ST7FLITEUS5B6
Description
MCU 8BIT 1KB FLASH 128KB 8-DIP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet

Specifications of ST7FLITEUS5B6

Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
5
Program Memory Size
1KB (1K x 8)
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
ST7
No. Of I/o's
5
Ram Memory Size
128Byte
Cpu Speed
8MHz
No. Of Timers
2
Rohs Compliant
Yes
For Use With
497-6403 - BOARD EVAL 8BIT MICRO + TDE1708497-6407 - BOARD EVAL FOR VACUUM CLEANER497-5861 - EVAL BRD POWER MOSFET/8PIN MCU497-5858 - EVAL BOARD PLAYBACK ST7FLITE497-5515 - EVAL BOARD PHASE CTRL DIMMER497-5049 - KIT STARTER RAISONANCE ST7FLITE497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
Other names
497-5636-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ST7FLITEUS5B6
Manufacturer:
STMicroelectronics
Quantity:
8
ST7LITEUS2, ST7LITEUS5
12.7
12.7.1
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Functional EMS (electromagnetic susceptibility)
Based on a simple running application on the product (toggling 2 LEDs through I/O ports),
the product is stressed by two electromagnetic events until a failure occurs (indicated by the
LEDs).
A device reset allows normal operations to be resumed. The test results are given in the
table below based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
Pre-qualification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
Table 59.
Symbol
V
V
FESD
FFTB
ESD: Electrostatic discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
standard.
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to V
V
conforms with the IEC 1000-4-4 standard.
Corrupted program counter
Unexpected reset
Critical Data corruption (control registers...)
SS
through a 100 pF capacitor, until a functional disturbance occurs. This test
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
Fast transient voltage burst limits to be
applied through 100 pF on V
pins to induce a functional disturbance
EMC characteristics
Parameter
DD
and V
DD
V
SO8 package,
conforms to IEC 1000-4-2
V
SO8 package,
conforms to IEC 1000-4-4
DD
DD
=5 V, T
=5 V, T
A
A
=+25 °C, f
=+25 °C, f
Conditions
Electrical characteristics
OSC
OSC
=8 MHz,
=8 MHz,
DD
105/136
and
Level/
class
3B
4B

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