DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 147
DF2170VTE33
Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.DF2170BVTE33V.pdf
(572 pages)
Specifications of DF2170VTE33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33
HD64F2170VTE33
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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16-Bit, 2-State Access Space: Figures 6.13 to 6.15 show bus timings for a 16-bit, 2-state access
space. When a 16-bit access space is accessed, the upper half (D15 to D8) of the data bus is used
for even addresses, and the lower half (D7 to D0) for odd addresses. Wait states cannot be
inserted.
Notes: 1. n = 3 to 0
Figure 6.13 Bus Timing for 16-Bit, 2-State Access Space (Even Address Byte Access)
2. When RDNn = 0
Write
Read
φ
Address bus
D15 to D8
D7 to D0
D15 to D8
D7 to D0
T
1
Bus cycle
High
High impedance
Valid
Rev. 2.00, 03/04, page 113 of 534
T
2
Invalid
Valid
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