DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 51
DF2170VTE33
Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.DF2170BVTE33V.pdf
(572 pages)
Specifications of DF2170VTE33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33
HD64F2170VTE33
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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SP
Notes:
1. When EXR is not used, it is not stored on the stack.
2. SP when EXR is not used.
3. lgnored when returning.
Figure 2.1 Exception Vector Table (Normal Mode)
(a) Subroutine Branch
H'0000
H'0001
H'0002
H'0003
H'0004
H'0005
H'0006
H'0007
H'0008
H'0009
H'000A
H'000B
Figure 2.2 Stack Structure in Normal Mode
(16 bits)
PC
(Reserved for system use)
(Reserved for system use)
Reset exception vector
Exception vector 1
Exception vector 2
(SP *
SP
2
)
(b) Exception Handling
Exception
vector table
Rev. 2.00, 03/04, page 17 of 534
(16 bits)
EXR*
Reserved*
CCR
CCR*
PC
1
3
1
, *
3
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