DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 458
DF2170VTE33
Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.DF2170BVTE33V.pdf
(572 pages)
Specifications of DF2170VTE33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33
HD64F2170VTE33
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Table 14.9 (3)
Rev. 2.00, 03/04, page 424 of 534
Item
Storage Area for
Program Data
Operation for
Selection of On-chip
Program to be
Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SC0 = 1 to FCCS
(Download)
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for
Settings of Initial
Parameter
Execution of
Initialization
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling
Routine
Operation for
Interrupt Inhibit
Switching MATs by
FMATS
Operation for Writing
H'5A to FKEY
Useable Area for Programming in User Boot Mode
On-chip
RAM
Storable/Executable Area
User Boot
MAT
×*
×
×
×
×
×
1
External Space
(Expanded
Mode)
×
×
×
User
MAT
User
Boot
MAT
Selected MAT
Embedded
Program
Storage Area
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