DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 549
DF2170VTE33
Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.DF2170BVTE33V.pdf
(572 pages)
Specifications of DF2170VTE33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33
HD64F2170VTE33
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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18.3.4
Table 18.9 DMAC Timing
Conditions: V
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
φ
Figure 18.19 Self-Refresh Timing (Return from Software Standby Mode: RAST = 1)
,
DMAC Timing
CC
= 3.0 V to 3.6 V, V
TRp
t
CASD1
Symbol
t
t
t
t
t
DRQS
DRQH
TED
DACD1
DACD2
TRr
t
SS
CSD2
= 0 V, φ = 10 MHz to 33 MHz
Min.
25
10
TRc
Max.
18
18
18
TRc
Self-refresh
Unit
ns
ns
Rev. 2.00, 03/04, page 515 of 534
Tpsr
t
CSD2
Test Conditions
Figure 18.23
Figure 18.22
Figures 18.20 and 18.21
DRAM access
t
CASD1
t
RPS1
Tp
Tr
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