DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 172

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

A setting can be made in bits RCW1 and RCW0 in REFCR to delay RAS signal output by one to
three cycles. Use bits RLW1 and RLW0 in REFCR to adjust the width of the RAS signal. The
settings of bits RCW1, RCW0, RLW1, and RLW0 are valid only in refresh operations.
Figure 6.39 shows the timing when bits RCW1 and RCW0 are set.
Rev. 2.00, 03/04, page 138 of 534
Figure 6.39 CBR Refresh Timing (RCW1 = 0, RCW0 = 1, RLW1 = 0, RLW0 = 0)
φ
(
φ
RTCNT
RTCOR
Refresh request
signal and CMF bit
setting signal
,
φ
)
(
,
)
T
Rp
Figure 6.37 Compare Match Timing
Figure 6.38 CBR Refresh Timing
T
Rp
N
T
Rrw
T
Rr
T
Rr
N
T
Rc1
T
Rc1
H'00
T
Rc2
T
Rc2