HD6417727F100C Renesas Electronics America, HD6417727F100C Datasheet - Page 48

• Manufacturer Part Number: HD6417727F100C
• Description: IC SUPERH MPU ROMLESS 240QFP
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7700r

Specifications of HD6417727F100C

• Core Processor: SH-3 DSP
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: FIFO, SCI, SIO, SmartCard, USB
• Peripherals: DMA, LCD, POR, WDT
• Number Of I /o: 104
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.6 V ~ 2.05 V
• Data Converters: A/D 6x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 240-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -

Figure 30.2 Continuous 32-MB Area Mode .............................................................................. 889
Figure 30.3 Continuous 16-MB Area Mode (Area 6)................................................................ 890
Figure 30.4 SH7727 Interface.................................................................................................... 903
Figure 30.5 PCMCIA Memory Card Interface Basic Timing ................................................... 907
Figure 30.6 PCMCIA Memory Card Interface Wait Timing..................................................... 908
Figure 30.7 PCMCIA I/O Card Interface Basic Timing............................................................ 909
Figure 30.8 PCMCIA I/O Card Interface Wait Timing ............................................................. 910
Figure 30.9 Dynamic Bus Sizing Timing for PCMCIA I/O Card Interface .............................. 911
Section 31 User-Debugging Interface (H-UDI)
Figure 31.1 H-UDI Block Diagram ........................................................................................... 916
Figure 31.2 TAP Controller State Transitions ........................................................................... 925
Figure 31.3 H-UDI Reset........................................................................................................... 927
Section 32 Electrical Characteristics
Figure 32.1 Power-On Sequence ............................................................................................... 930
Figure 32.2 Power Supply Voltage and Operating Frequency .................................................. 935
Figure 32.3 EXTAL Clock Input Timing .................................................................................. 941
Figure 32.4 CKIO Clock Input Timing ..................................................................................... 941
Figure 32.5 CKIO Clock Output Timing................................................................................... 942
Figure 32.6 Power-on Oscillation Settling Time ....................................................................... 942
Figure 32.7 Oscillation Settling Time at Standby Return (Return by Reset)............................. 943
Figure 32.8 Oscillation Settling Time at Standby Return (Return by NMI).............................. 943
Figure 32.9 Oscillation Settling Time at Standby Return (Return by IRQ4 to IRQ0)............... 944
Figure 32.10 PLL Synchronization Settling Time by Reset or NMI Interrupt ............................ 944
Figure 32.11 PLL Synchronization Settling Time by IRQ/IRL and PINT0/1 Interrupt .............. 945
Figure 32.12 PLL Sync Stabilization Time at Frequency Multiplier Factor Change .................. 945
Figure 32.13 Reset Input Timing................................................................................................. 947
Figure 32.14 Interrupt signal Input Timing ................................................................................. 947
Figure 32.15 Bus Release Timing ............................................................................................... 948
Figure 32.16 Pin Drive Timing at Standby.................................................................................. 948
Figure 32.17 Basic Bus Cycle (No Wait) .................................................................................... 951
Figure 32.18 Basic Bus Cycle (One Wait) .................................................................................. 952
Figure 32.19 Basic Bus Cycle (External Wait, WAITSEL = 1) .................................................. 953
Figure 32.20 Burst ROM Bus Cycle (No Wait) .......................................................................... 954
Figure 32.21 Burst ROM Bus Cycle (Two Waits) ...................................................................... 955
Figure 32.22 Burst ROM Bus Cycle (External Wait, WAITSEL = 1) ........................................ 956
Figure 32.23 Synchronous DRAM Read Bus Cycle (RCD = 0, CAS Latency = 1, TPC = 0)..... 957
Figure 32.24 Synchronous DRAM Read Bus Cycle (RCD = 2, CAS Latency = 2, TPC = 1)..... 958
Figure 32.25 Synchronous DRAM Read Bus Cycle (Burst Read (Single Read × 4),
RCD = 0, CAS Latency = 1, TPC = 1) ................................................................... 959
Rev.6.00 Mar. 27, 2009 Page xlvi of lvi
REJ09B0254-0600