TXC-06312BIOG Transwitch Corporation, TXC-06312BIOG Datasheet - Page 195

• Manufacturer Part Number: TXC-06312BIOG
• Manufacturer: Transwitch Corporation

Specifications of TXC-06312BIOG

• Lead Free Status / Rohs Status: Supplier Unconfirmed

The PHAST-12N device is packaged in a 376-lead, 23 mm x 23 mm, plastic ball grid array package suitable for
surface mounting, as illustrated in
1 9 5 o f 2 02
(A3)
Notes:
1. All dimensions are in millimeters. Values
2. Identification of the solder ball A1 corner is
3. Size of array: 22 x 22, JEDEC code MO-151.
D D2
shown are for reference only.
contained within this shaded zone. Package
corner may not be a 90 angle.
A2
Figure 55. PHAST-12N TXC-06312B 376-Lead Plastic Ball Grid Array Package
E1/4
TRANSWITCH
TXC-06312BIOG
D1/4
E2
Figure
Note 2
E
55.
Dimension (Note 1)
A
-D1-
P
D1 (Nom)
E1 (Nom)
A3 (Ref.)
A1
e (Ref.)
ACKAGE
A1
A2
D2
E2
A
D
E
b
AB AA Y W V
U
T
Bottom View
R
P N M
PRELIMINARY TXC-06312B-MB, Ed. 2
-E1-
I
19.45
19.45
L
Min
2.02
0.40
1.12
0.50
NFORMATION
K J H
PHAST-12N Device
G F
23.00
21.00
23.00
21.00
0.56
1.00
E
D
C B
DATA SHEET
A
20.20
20.20
Max
2.44
0.60
1.22
0.70
TXC-06312B
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
June 2005
b
e