MT48LC16M16LFFG Micron Technology Inc, MT48LC16M16LFFG Datasheet - Page 61

• Manufacturer Part Number: MT48LC16M16LFFG
• Manufacturer: Micron Technology Inc

Specifications of MT48LC16M16LFFG

• Lead Free Status / Rohs Status: Not Compliant

NOTE: 1. All dimensions are in millimeters.
Data Sheet Designation
terization limits that are subject to change upon full
characterization of production devices.
256Mb: x16 Mobile SDRAM
MobileRamY26L_B.p65 – Pub. 04/03
Preliminary: This data sheet contains initial charac-
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.33
SEATING PLANE
Micron, the M logo, and the Micron logo are trademarks and/or service marks of Micron Technology, Inc.
54X ∅0.35
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
6.40
0.10 C
3.20 ±0.05
BALL A9
0.700 ±0.075
C
3.20 ±0.05
All other trademarks are the property of their respective owners.
8.00 ±0.10
6.40
C L
4.00 ±0.05
VFBGA “FG” PACKAGE
54-pin, 8mm x 14mm
0.155 ±0.013
(Bottom View)
1.80 ±0.05
CTR
C L
0.80 TYP
BALL A1
0.80 TYP
7.00 ±0.05
BALL A1 ID
61
14.00 ±0.10
1.00 MAX
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .27mm
MOBILE SDRAM
©2003 Micron Technology, Inc. All rights reserved.
BALL A1 ID
256Mb: x16
PRELIMINARY