LFXP10C-3F388I Lattice, LFXP10C-3F388I Datasheet - Page 387

• Manufacturer Part Number: LFXP10C-3F388I
• Description: FPGA LatticeXP Family 10000 Cells 320MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 388-Pin FBGA Tray
• Manufacturer: Lattice

Specifications of LFXP10C-3F388I

• Package: 388FBGA
• Family Name: LatticeXP
• Device Logic Units: 10000
• Maximum Internal Frequency: 320 MHz
• Typical Operating Supply Voltage: 1.8|2.5|3.3 V
• Maximum Number Of User I/os: 244
• Ram Bits: 221184
• Re-programmability Support: Yes
• Lead Free Status / Rohs Status: Contains lead / RoHS non-compliant

Lattice Semiconductor
256-ball caBGA BGA Breakout Examples
This BGA breakout and routing example places a MachXO PLD in a 14x14 mm, 0.8 mm pitch, 256-ball caBGA
package (LCMXO2280-B256/BN256) into two fabrication scenarios. One for a 6-layer stack up with maximum I/O
utilization and a 4-layer with about 10% fewer I/Os. The 6-layer design (Example #1), demonstrates the best use of
mechanically drill blind vias to place caps near power pins to minimize layers.
Figure 14-10. CAM Artwork Screen Shots, Example #1, 256-Ball caBGA
Layer 1 Primary
Layer 5 Signal
Layer 3 GND
14-12
Layer 6 Secondary
PCB Layout Recommendations
Layer 2 Signal
Layer 4 Power
for BGA Packages