DSPB56366AG120 Freescale Semiconductor, DSPB56366AG120 Datasheet - Page 97

• Manufacturer Part Number: DSPB56366AG120
• Description: IC DSP 24BIT AUD 120MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: Symphony™r
• Type: Audio Processorr

Specifications of DSPB56366AG120

• Interface: Host Interface, I²C, SAI, SPI
• Clock Rate: 120MHz
• Non-volatile Memory: ROM (240 kB)
• On-chip Ram: 69kB
• Voltage - I/o: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

5
5.1
An estimation of the chip junction temperature, T
Where:
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and
a case-to-ambient thermal resistance.
Where:
R
change the case-to-ambient thermal resistance, R
the device, add a heat sink, change the mounting arrangement on the printed circuit board (PCB), or
otherwise change the thermal dissipation capability of the area surrounding the device on a PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through
the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where
the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the
device thermal performance may need the additional modeling capability of a system level thermal
simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which
the package is mounted. Again, if the estimations obtained from R
the thermal performance is adequate, a system level model may be appropriate.
A complicating factor is the existence of three common ways for determining the junction-to-case thermal
resistance in plastic packages.
Freescale Semiconductor
θJC
•
is device-related and cannot be influenced by the user. The user controls the thermal environment to
Design Considerations
To minimize temperature variation across the surface, the thermal resistance is measured from the
junction to the outside surface of the package (case) closest to the chip mounting area when that
surface has a proper heat sink.
Thermal Design Considerations
T
R
P
R
R
R
A
D
qJA
θJA
θJC
θCA
= ambient temperature °C
= package junction-to-ambient thermal resistance °C/W
= power dissipation in package W
= package junction-to-ambient thermal resistance °C/W
= package junction-to-case thermal resistance °C/W
= package case-to-ambient thermal resistance °C/W
DSP56366 Technical Data, Rev. 3.1
T
R
J
θJA
=
T
=
A
θCA
J
+
R
, in °C can be obtained from the following equation:
(
θJC
. For example, the user can change the air flow around
P
D
+
×
R
R
θCA
θJA
)
θJA
do not satisfactorily answer whether
5-1