EP3C55F484I7 Altera, EP3C55F484I7 Datasheet - Page 62

• Manufacturer Part Number: EP3C55F484I7
• Description: IC CYCLONE III FPGA 55K 484 FBGA
• Manufacturer: Altera
• Series: Cyclone® IIIr

Specifications of EP3C55F484I7

• Number Of Logic Elements/cells: 55856
• Number Of Labs/clbs: 3491
• Total Ram Bits: 2396160
• Number Of I /o: 327
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 484-FBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Gates: -

Page 62
“Board Design Considerations” on page 17
“Design and Compilation” on page 28
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Done
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Use the correct hardware setup when interfacing the Cyclone III device with 3.3/3.0/2.5-V
LVTTL/LVCMOS I/O systems.
Use the Quartus II software to check the restriction on the pin placement.
Minimize the simultaneous switching noise effect on the board with the following methods:
l
l
l
l
l
Connect the device unused pins to the board according to the behavior of the pins.
Terminate the signals according to the I/O standard and signal travel direction.
Perform board-level IBIS or HSPICE simulation.
Minimize the noise on the power planes.
Consider the power-up requirement and I/O behavior of the Cyclone III device during power
up.
Add the correct series resistance to the appropriate configuration signals based on the
configuration scheme used.
Use repeater buffers for the configuration signals when cascading Cyclone III devices in
multi-device configuration.
Ensure that the
Pull the configuration pins high or low through resistors with the recommended values.
Ensure that the devices in a configuration chain are connected properly.
To prevent the signals to the configuration pins from overshooting to more than 4.1 V, use
series resistors and buffers according to the setup.
Do not leave the
Connect the
For AP configuration, select the flash memory from the Intel P30 and P33 families that can
support 40-MHz clock.
Check the pin connection for other pins of the configuration device or flash memory.
Use the
Depending on the on-chip debugging method used, reserve additional resources such as
LE, memory and I/O, and route the JTAG pins out.
Consider the trade-off between schematics or HDL for your design entry based on your
design’s complexity.
Other than the Quartus II software, consider building your design with third-party EDA tools,
SOPC Builder, or IP cores.
If you are using HDL for design entry, use the recommended coding styles.
Distributing simultaneous switching I/O to different I/O banks
Setting unused I/O pins to V
Turning on the slow slew rate feature for the switching pins
Using a lower drive strength for the switching pins
Using the proper termination scheme for the switching pins
areset
MSEL
DCLK
JTAG
,
locked
pins to V
or
pins unconnected.
TCK
CC A
or
signals are clean.
pfdena
C C
or ground directly based on the configuration scheme used.
or ground
control signals as required by your design.
© November 2008 Altera Corporation
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