PIC24HJ32GP202-I/SO Microchip Technology Inc., PIC24HJ32GP202-I/SO Datasheet - Page 230

• Manufacturer Part Number: PIC24HJ32GP202-I/SO
• Description: 16-BIT MCU, 28LD, 32KB FLASH, 40 MIPS, NANOWATT
• Manufacturer: Microchip Technology Inc.

Specifications of PIC24HJ32GP202-I/SO

• A/d Inputs: 10 Channel, 12-Bit
• Cpu Speed: 40 MIPS
• Eeprom Memory: 0 Bytes
• Input Output: 21
• Interface: I2C/SPI/UART
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 28-pin SOIC
• Programmable Memory: 32K Bytes
• Ram Size: 2K Bytes
• Timers: 3-16-bit, 1-32-bit
• Voltage, Range: 3-3.6 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PIC24HJ32GP202/204 and PIC24HJ16GP304
22.2
DS70289A-page 228
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Preliminary
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
e
1.345
MIN
.120
.015
.290
.240
.110
.008
.040
.014
A2
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
© 2007 Microchip Technology Inc.
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
c