PIC24HJ32GP202-I/SO Microchip Technology Inc., PIC24HJ32GP202-I/SO Datasheet - Page 234

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PIC24HJ32GP202-I/SO

Manufacturer Part Number
PIC24HJ32GP202-I/SO
Description
16-BIT MCU, 28LD, 32KB FLASH, 40 MIPS, NANOWATT
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of PIC24HJ32GP202-I/SO

A/d Inputs
10 Channel, 12-Bit
Cpu Speed
40 MIPS
Eeprom Memory
0 Bytes
Input Output
21
Interface
I2C/SPI/UART
Memory Type
Flash
Number Of Bits
16
Package Type
28-pin SOIC
Programmable Memory
32K Bytes
Ram Size
2K Bytes
Timers
3-16-bit, 1-32-bit
Voltage, Range
3-3.6 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device
PIC24HJ32GP202/204 and PIC24HJ16GP304
DS70289A-page 232
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
Preliminary
φ
E1
Units
A2
A1
E1
D1
L
L1
N
D
e
A
L
E
b
α
β
NOTE 2
φ
c
E
A1
A
0.95
0.05
0.45
0.09
0.30
MIN
11°
11°
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
Microchip Technology Drawing C04-076B
© 2007 Microchip Technology Inc.
α
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13°
13°
A2

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