GD82559C S L3DF Intel, GD82559C S L3DF Datasheet - Page 10

• Manufacturer Part Number: GD82559C S L3DF
• Manufacturer: Intel

Specifications of GD82559C S L3DF

• Lead Free Status / Rohs Status: Not Compliant

82559 — Networking Silicon
1.3
2
The following is a list of changes that were made from the 82558 B-step Fast Ethernet Controller to
the 82559 Fast Ethernet Multifunction PCI/CardBusController.
Enhancements to the 82559 C-Step
The success of the 82559 B-step in mobile designs has spurred the addition of several new features
to the device. These enhancements integrate new capabilities into the 82559 for both CardBus and
MiniPCI system designs:
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Modem interface for combination solution (LAN and modem) in PCI and CardBus designs
Low power consumption for LAN/modem combination designs to meet CardBus power
requirements
Compliance with Advanced Configuration and Power Interface and PCI Power Management
specifications
Support for wake-up on interesting packets and link status change
Support for remote power-up using Wake on LAN* (WOL) technology
Deep power-down mode support
Support of Total Cost of Ownership (TCO) management interface and Wired for Management
(WfM)
Backward compatible software with 82558 and 82557
TCP/UDP checksum offload capabilities
Support for Intel’s Adaptive Technology
Use of 3.3 V power supply (82559) versus 5 V power supply
Individual Address, Multicast Address, and ARP wake-up events merged into extended
programmable wake-up packet command and removed from the CSMA command
Receive collision bit in the RFD status word replaced with a TCO indication bit
SMB port implemented to support TCO management interface
PHY identifier in MII Register 3 modified
External PHY support removed
PHY-based flow control removed (802.3x flow control was not removed)
Reducing the declared Flash window requirement to 128 bytes from 1 Mbyte.
Adding glueless support for PXE Flash ROM in LAN/modem combination designs by adding
an external gating signal
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