DS3170N+ Maxim Integrated Products, DS3170N+ Datasheet - Page 206
![IC TXRX DS3/E3 100-CSBGA](/photos/6/94/69414/100-csbga_21-0153b_sml.jpg)
DS3170N+
Manufacturer Part Number
DS3170N+
Description
IC TXRX DS3/E3 100-CSBGA
Manufacturer
Maxim Integrated Products
Datasheet
1.DS3170.pdf
(230 pages)
Specifications of DS3170N+
Function
Single-Chip Transceiver
Interface
DS3, E3
Number Of Circuits
1
Voltage - Supply
3.135 V ~ 3.465 V
Current - Supply
120mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
100-LBGA
Includes
DS3 Framers, E3 Framers, HDLC Controller, On-Chip BERTs
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
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DS3170 DS3/E3 Single-Chip Transceiver
CLAMP. All digital output pins output data from the boundary scan parallel output while connecting the bypass
register between JTDI and JTDO. The outputs do not change during the CLAMP instruction. If the previous
instruction was not EXTEST, the outputs will be driven according to the values in the boundary scan register at the
positive edge of JTCLK in the Update-IR state. The typical use of this instruction is in a system that has the JTAG
scan chain of multiple chips connected in series, and all of the chips have their outputs initialized using the
EXTEST mode. Then some of the chips are left initialized using the CLAMP mode and others have their IO
controlled using the EXTEST mode. This reduces the size of the scan chain during the partial testing of the system.
13.4 JTAG ID Codes
Table 13-2. JTAG ID Codes
REVISION
DEVICE CODE
MANUFACTURER’S CODE
REQUIRED
DEVICE
ID[31:28]
ID[27:12]
ID[11:1]
ID[0]
DS3170
Consult factory
0000000001001111
00010100001
1
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