PIC18F13K50-E/P MICROCHIP [Microchip Technology], PIC18F13K50-E/P Datasheet - Page 373

• Manufacturer Part Number: PIC18F13K50-E/P
• Manufacturer: MICROCHIP [Microchip Technology]

27.6
© 2009 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1:
Param
No.
2:
3:
Thermal Considerations
P
INTERNAL
T
P
TBD = To Be Determined
I
T
T
Sym
P
DD
JMAX
θ
θ
PD
A
J
DER
JC
I
JA
/
= Ambient Temperature
= Junction Temperature
O
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
≤ +125°C
PIC18F1XK50/PIC18LF1XK50
Preliminary
108.1
TBD
62.4
85.2
31.4
Typ
150
24
24
24
—
—
—
—
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
W
W
W
W
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 5x5mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 6x6mm package
PD = P
P
P
P
INTERNAL
I
DER
/
O
= Σ (I
= PD
INTERNAL
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) + Σ (I
- T
DD
I
/
O
A
DS41350C-page 371
(1)
)/θ
OH
JA
(2)
* (V
DD
- V
OH
))