MT55L256L36P MICRON [Micron Technology], MT55L256L36P Datasheet

MT55L256L36P

Manufacturer Part Number

MT55L256L36P

Description

8Mb ZBT SRAM

Manufacturer

MICRON [Micron Technology]

Datasheet

1.MT55L256L36P.pdf (30 pages)

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MT55L256L36P-10A

Quantity:

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MT55L256L36P-10A

Quantity:

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Download datasheet (496Kb)

8Mb

ZBT

FEATURES

• High frequency and 100 percent bus utilization

• Fast cycle times: 6ns, 7.5ns and 10ns

• Single +3.3V ±5% power supply (V

• Separate +3.3V or +2.5V isolated output buffer

• Advanced control logic for minimum control

• Individual BYTE WRITE controls may be tied LOW

• Single R/W# (read/write) control pin

• CKE# pin to enable clock and suspend operations

• Three chip enables for simple depth expansion

• Clock-controlled and registered addresses, data

• Internally self-timed, fully coherent WRITE

• Internally self-timed, registered outputs to

• SNOOZE MODE for reduced-power standby

• Common data inputs and data outputs

• Linear or Interleaved Burst Modes

• Burst feature (optional)

• Pin/function compatibility with 2Mb, 4Mb, and

• Automatic power-down

• 100-pin TQFP package

• 165-pin FBGA package

• 119-pin BGA package

OPTIONS

• Timing (Access/Cycle/MHz)

• Configurations

• Package

• Operating Temperature Range

8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM

MT55L512L18P_2.p65 – Rev. 6/01

supply (V

signal interface

I/Os and control signals

eliminate the need to control OE#

18Mb ZBT SRAM

3.5ns/6ns/166 MHz

4.2ns/7.5ns/133 MHz

5ns/10ns/100 MHz

3.3V I/O

2.5V I/O

100-pin TQFP

165-pin, 13mm x 15mm FBGA

119-pin, 14mm x 22mm BGA

Commercial (0ºC to +70ºC)

Industrial (-40°C to +85°C)**

512K x 18

256K x 32

256K x 36

512K x 18

256K x 32

256K x 36

SRAM

MT55L512V18P

MT55L256V32P

MT55L256V36P

MT55L512L18P

MT55L256L32P

MT55L256L36P

MARKING*

)

None

-7.5

-10

-6

MT55L512L18P, MT55L512V18P,

MT55L256L32P, MT55L256V32P,

MT55L256L36P, MT55L256V36P

3.3V V

* A Part Marking Guide for the FBGA devices can be found on Micron’s

** Industrial temperature range offered in specific speed grades and

NOTE: 1. JEDEC-standard MS-026 BHA (LQFP).

web

confgurations. Contact factory for more information.

site—http://www.micron.com/support/index.html.

8Mb: 512K x 18, 256K x 32/36

2. JEDEC-standard MS-028 BHA (PBGA).

, 3.3V or 2.5V I/O

Micron Technology, Inc., reserves the right to change products or specifications without notice.

(Preliminary Package Data)

MT55L256L32PT-7.5

100-Pin TQFP

165-Pin FBGA

119-Pin BGA

PIPELINED ZBT SRAM

Part Number Example:

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