MT55L256L36P MICRON [Micron Technology], MT55L256L36P Datasheet - Page 11

• Manufacturer Part Number: MT55L256L36P
• Description: 8Mb ZBT SRAM
• Manufacturer: MICRON [Micron Technology]

FBGA PIN DESCRIPTIONS (CONTINUED)
8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
MT55L512L18P_2.p65 – Rev. 6/01
1A, 1B, 1C, 1D, 1A, 1B, 1P,
10G, 10H, 10N,
5D, 5E, 5F, 5G, 5D, 5E, 5F, 5G,
6E, 6F, 6G, 6H, 6E, 6F, 6G, 6H,
7G, 7H, 7J, 7K, 7G, 7H, 7J, 7K,
1P, 2C, 2J, 2K, 2R, 3H, 5N,
6J, 6K, 6L, 6M, 6J, 6K, 6L, 6M,
7L, 7M, 8C, 8N 7L, 7M, 8C, 8N
2P, 2R, 3H, 4B, 10C, 10H, 10N,
5H, 5J, 5K, 5L, 5H, 5J, 5K, 5L,
7C, 7D, 7E, 7F, 7C, 7D, 7E, 7F,
10D, 10E, 10F,
5P, 7P, 5R, 7R 5P, 7P, 5R, 7R
11B, 11J, 11K,
2L, 2M, 2N,
9B, 9H, 10C,
5M, 6C, 6D,
5A, 5N, 6N,
1E, 1F, 1G,
4C, 4N, 5C,
11L, 11M,
11N, 11P
x18
11A, 11B, 11P
6N, 9B, 9H,
5M, 6C, 6D,
2C, 2N, 2P,
4C, 4N, 5C,
x32/x36
SYMBOL
DNU
V
NC
NF
SS
Supply Ground: GND.
TYPE
—
–
–
Do Not Use: These signals may either be unconnected or wired to
GND to improve package heat dissipation.
No Connect: These signals are not internally connected and may be
connected to ground to improve package heat dissipation.
Pin 9B is reserved for address pin expansion; 16MB.
No Function: These pins are internally connected to the die and
have the capacitance of an input pin. It is allowable to leave
these pins unconnected or driven by signals.
11
8Mb: 512K x 18, 256K x 32/36
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DESCRIPTION
PIPELINED ZBT SRAM
©2001, Micron Technology, Inc.