MT55L256L36P MICRON [Micron Technology], MT55L256L36P Datasheet - Page 15

• Manufacturer Part Number: MT55L256L36P
• Description: 8Mb ZBT SRAM
• Manufacturer: MICRON [Micron Technology]

BGA PIN DESCRIPTIONS (continued)
8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
MT55L512L18P_2.p65 – Rev. 6/01
3M, 3N, 3P,
2U, 3U, 4U,
6M, 6P, 6U,
5G, 5H, 5K,
7B, 7C, 7D,
7H, 7L, 7N,
3H, 3K, 3L,
5M, 5N, 5P
1G, 1K, 1P,
1R, 1T, 2D,
6E, 6G, 6K,
3D, 3E, 3F,
5D, 5E, 5F,
1B, 1C, 1E,
2F, 2H, 2L,
2N, 3J, 4D,
4L, 4T, 5J,
x 1 8
5U
7 R
3H, 3K, 3M,
5K, 5M, 5N,
2U, 3U, 4U,
3N, 3P, 5D,
1B, 1C, 1R,
3D, 3E, 3F,
5E, 5F, 5H,
4D, 4L, 5J,
1T, 2T, 3J,
6T, 6U, 7B,
x32/x36
7C, 7R
5U
5P
S Y M B O L T Y P E
DNU
V
N C
NF
SS
Supply Ground: GND.
—
–
–
Do Not Use: These signals may either be unconnected or wired
to GND to improve package heat dissipation.
No Connect: These signals are not internally connected and
may be connected to ground to improve package heat
dissipation.
No Function: These pins are internally connected to the die and
have the capacitance of an input pin. It is allowable to leave
these pins unconnected or driven by signals.
15
8Mb: 512K x 18, 256K x 32/36
Micron Technology, Inc., reserves the right to change products or specifications without notice.
D E S C R I P T I O N
PIPELINED ZBT SRAM
©2001, Micron Technology, Inc.