MT55L256L36P MICRON [Micron Technology], MT55L256L36P Datasheet - Page 29

• Manufacturer Part Number: MT55L256L36P
• Description: 8Mb ZBT SRAM
• Manufacturer: MICRON [Micron Technology]

8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
MT55L512L18P_2.p65 – Rev. 6/01
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
A1 CORNER
A1 CORNER
E-mail: [e-mail], Internet: http://www.micronsemi.com, Customer Comment Line: 800-932-4992
2. Solder ball land pad is 0.6mm.
22.00 ±0.20
19.94 ±0.10
20.32
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc.,
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
and the architecture is supported by Micron Technology, Inc., and Motorola Inc.
Ø
0.75 ±0.15
Micron is a registered trademark of Micron Technology, Inc.
MIN
(dimension applies to a
noncollapsed solder ball)
11.94 ±0.10
1.27 (TYP)
1.27 (TYP)
14.00 ±0.10
119-PIN BGA
7.62
29
SEATING PLANE
8Mb: 512K x 18, 256K x 32/36
0.15
Micron Technology, Inc., reserves the right to change products or specifications without notice.
PIPELINED ZBT SRAM
Substrate material:
BT resin laminate
0.60 ±0.10
©2001, Micron Technology, Inc.
0.90 ±0.10
2.40 MAX