C8051F350-TB Silicon Laboratories Inc, C8051F350-TB Datasheet - Page 132
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C8051F350-TB
Manufacturer Part Number
C8051F350-TB
Description
PROTOTYPINGBOARDWITH C8051F350
Manufacturer
Silicon Laboratories Inc
Type
MCUr
Specifications of C8051F350-TB
Contents
Board
Processor To Be Evaluated
C8051F35x
Interface Type
USB
Silicon Manufacturer
Silicon Labs
Core Architecture
8051
Silicon Core Number
C8051F350
Silicon Family Name
C8051F35x
Kit Contents
Board
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With/related Products
C8051F350
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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C8051F350/1/2/3
The capacitors shown in the external crystal configuration provide the load capacitance required by the
crystal for correct oscillation. These capacitors are “in series” as seen by the crystal and “in parallel” with
the stray capacitance of the XTAL1 and XTAL2 pins.
Note: The load capacitance depends upon the crystal and the manufacturer. Please refer to the crystal
datasheet when completing these calculations.
For example, a tuning-fork crystal of 32.768 kHz with a recommended load capacitance of 12.5 pF should
use the configuration shown in Figure 17.1, Option 1. The total value of the capacitors and the stray
capacitance of the XTAL pins should equal 25 pF. With a stray capacitance of 3 pF per pin, the 22 pF
capacitors yield an equivalent capacitance of 12.5 pF across the crystal, as shown in Figure 17.2.
22 pF
XTAL1
Ω
32.768 kHz
10 M
XTAL2
22 pF
Figure 17.2. 32.768 kHz External Crystal Example
Important note on external crystals: Crystal oscillator circuits are quite sensitive to PCB layout. The
crystal should be placed as close as possible to the XTAL pins on the device. The traces should be as
short as possible and shielded with ground plane from any other traces which could introduce noise or
interference.
132
Rev. 1.1
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