HD64F3337YCP16 Renesas Electronics America, HD64F3337YCP16 Datasheet - Page 28

• Manufacturer Part Number: HD64F3337YCP16
• Description: IC H8 MCU FLASH 60K 84PLCC
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300r

Specifications of HD64F3337YCP16

• Core Processor: H8/300
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: Host Interface, I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 74
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 84-PLCC
• Package: 84PLCC
• Family Name: H8
• Maximum Speed: 16 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 74
• Interface Type: HIF/I2C/SCI
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

15.5 Interrupts............................................................................................................................ 348
15.6 Useage Notes ..................................................................................................................... 348
Section 16 D/A Converter (H8/3337 Series Only)
16.1 Overview............................................................................................................................ 353
16.2 Register Descriptions ........................................................................................................ 356
16.3 Operation ........................................................................................................................... 358
Section 17 RAM
17.1 Overview............................................................................................................................ 359
17.2 Operation ........................................................................................................................... 360
Section 18 ROM (Mask ROM Version/ZTAT Version)
18.1 Overview............................................................................................................................ 361
18.2 Writer Mode (H8/3337Y, H8/3334Y) ............................................................................... 362
18.3 PROM Programming ......................................................................................................... 366
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15.4.1 Single Mode (SCAN = 0) ..................................................................................... 342
15.4.2 Scan Mode (SCAN = 1) ....................................................................................... 344
15.4.3 Input Sampling and A/D Conversion Time.......................................................... 346
15.4.4 External Trigger Input Timing ............................................................................. 347
15.6.1 Setting Ranges of Analog Power Supply Pins, Etc. ............................................. 348
15.6.2 Notes on Board Design ........................................................................................ 348
15.6.3 Notes on Noise ..................................................................................................... 348
15.6.4 A/D Conversion Accuracy Definitions ................................................................ 349
15.6.5 Allowable Signal-Source Impedance ................................................................... 351
15.6.6 Effect on Absolute Accuracy................................................................................ 352
16.1.1 Features ................................................................................................................ 353
16.1.2 Block Diagram...................................................................................................... 354
16.1.3 Input and Output Pins........................................................................................... 355
16.1.4 Register Configuration ......................................................................................... 355
16.2.1 D/A Data Registers 0 and 1 (DADR0, DADR1).................................................. 356
16.2.2 D/A Control Register (DACR)............................................................................. 356
17.1.1 Block Diagram...................................................................................................... 359
17.1.2 RAM Enable Bit (RAME) in System Control Register (SYSCR) ....................... 360
17.2.1 Expanded Modes (Modes 1 and 2)....................................................................... 360
17.2.2 Single-Chip Mode (Mode 3) ................................................................................ 360
18.1.1 Block Diagram...................................................................................................... 362
18.2.1 Writer Mode Setup ............................................................................................... 362
18.2.2 Socket Adapter Pin Assignments and Memory Map ........................................... 363
18.3.1 Programming and Verification ............................................................................. 366
18.3.2 Notes on Programming......................................................................................... 371
18.3.3 Reliability of Programmed Data .......................................................................... 371
18.3.4 Erasing Data ......................................................................................................... 372
................................................................................................................... 359
.................................................... 353
.......................................... 361