HD64F3337YCP16 Renesas Electronics America, HD64F3337YCP16 Datasheet - Page 404

• Manufacturer Part Number: HD64F3337YCP16
• Description: IC H8 MCU FLASH 60K 84PLCC
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300r

Specifications of HD64F3337YCP16

• Core Processor: H8/300
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: Host Interface, I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 74
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 84-PLCC
• Package: 84PLCC
• Family Name: H8
• Maximum Speed: 16 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 74
• Interface Type: HIF/I2C/SCI
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

If a series of write errors occurs while the same PROM programmer is in use, stop programming
and check the PROM programmer and socket adapter for defects, using a microcontroller with on-
chip EPROM in a windowed package, for instance.
Please inform Hitachi of any abnormal conditions noted during programming or in screening of
program data after high-temperature baking.
18.3.4
Data is erased by exposing the transparent window in the package to ultraviolet light. The erase
conditions are shown in table 18.7.
Table 18.7 Erase Conditions
Item
Ultraviolet wavelength
Minimum irradiation
The erase conditions in table 18.7 can be met by exposure to a 12000 W/cm
positioned 2 to 3 cm directly above the chip for approximately 20 minutes.
372
Erasing Data
Figure 18.7 Recommended Screening Procedure
Value
253.7nm
15W • s/cm
Bake with power off
125 C to 150 C,
24 Hr to 48 Hr
Write and verify program
Read and check program
2
Install
2
ultraviolet lamp