LPC3141FET180,551 NXP Semiconductors, LPC3141FET180,551 Datasheet - Page 2

IC ARM9 MCU USB OTG 180TFBGA

LPC3141FET180,551

Manufacturer Part Number
LPC3141FET180,551
Description
IC ARM9 MCU USB OTG 180TFBGA
Manufacturer
NXP Semiconductors
Series
LPC3000r
Datasheet

Specifications of LPC3141FET180,551

Package / Case
180-TFBGA
Core Processor
ARM9
Core Size
32-Bit
Speed
270MHz
Connectivity
EBI/EMI, I²C, IrDA, MMC, PCM, SPI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, PWM, WDT
Number Of I /o
20
Program Memory Type
ROMless
Ram Size
192K x 8
Voltage - Supply (vcc/vdd)
1.1 V ~ 3.6 V
Data Converters
A/D 4x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC31
Core
ARM926EJS
Data Bus Width
32 bit
Data Ram Size
192 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
270 MHz
Number Of Timers
5
Operating Supply Voltage
1.2 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
OM11037
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
935289711551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC3141FET180,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
3. Ordering information
Table 1.
Table 2.
LPC3141_3143
Preliminary data sheet
Type number
LPC3141FET180 TFBGA180 Plastic thin fine pitch ball grid array package, 180 balls, body 12 × 12 × 0.8 mm SOT570-3
LPC3143FET180 TFBGA180 Plastic thin fine pitch ball grid array package, 180 balls, body 12 × 12 × 0.8 mm SOT570-3
Type number
LPC3141FET180
LPC3143FET180
Ordering information
Ordering options for LPC3141/3143
3.1 Ordering options
Package
Name
Core/bus
frequency
270/
90 MHz
270/
90 MHz
Operating voltage and temperature
TFBGA180 package: 12
Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB
On the LPC3143 only: secure booting using an AES decryption engine from SPI
flash, NAND flash, SD/MMC cards, UART, or USB.
DMA controller
Four 32-bit timers
Watchdog timer
PWM module
Master/slave PCM interface
Random Number Generator (RNG)
General Purpose I/O pins (GPIO)
Flexible and versatile interrupt structure
JTAG interface with boundary scan and ARM debug access
Core voltage: 1.2 V
I/O voltages: 1.8 V, 3.3 V
Temperature: −40 °C to +85 °C
Description
Total
SRAM
192 kB
192 kB
All information provided in this document is subject to legal disclaimers.
Security
engine
AES
no
yes
Rev. 0.16 — 27 May 2010
High-speed USB
Device/
Host/OTG
Device/
Host/OTG
x
12 mm, 0.8 mm pitch
10-bit
ADC
channels
4
4
I
I
2 each yes
2 each yes
2
2
S/
C
LPC3141/3143
MCI
SDHC/
SDIO/
CE-ATA
© NXP B.V. 2010. All rights reserved.
Temperature
range
−40 °C to +85 °C
−40 °C to +85 °C
Version
2 of 74

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