LPC3141FET180,551 NXP Semiconductors, LPC3141FET180,551 Datasheet - Page 68

• Manufacturer Part Number: LPC3141FET180,551
• Description: IC ARM9 MCU USB OTG 180TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC3000r

Specifications of LPC3141FET180,551

• Package / Case: 180-TFBGA
• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 270MHz
• Connectivity: EBI/EMI, I²C, IrDA, MMC, PCM, SPI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, PWM, WDT
• Number Of I /o: 20
• Program Memory Type: ROMless
• Ram Size: 192K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC31
• Core: ARM926EJS
• Data Bus Width: 32 bit
• Data Ram Size: 192 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 270 MHz
• Number Of Timers: 5
• Operating Supply Voltage: 1.2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11037
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935289711551

NXP Semiconductors
12. Package outline
Fig 29. LPC3141/3143 TFBGA180 package outline
LPC3141_3143
Preliminary data sheet
TFBGA180: thin fine-pitch ball grid array package; 180 balls
DIMENSIONS (mm are the original dimensions)
mm
UNIT
VERSION
SOT570-3
OUTLINE
max
nom
min
ball A1
index area
ball A1
index area
1.20
1.06
0.95
A
P
M
K
H
D
B
F
0.40
0.35
0.30
N
G
E
C
A
L
J
A
1
IEC
1
0.80
0.71
0.65
2
A
2
3
4
0.50
0.45
0.40
e
5
b
6
7
12.1
12.0
11.9
e
D
JEDEC
D
1
8
All information provided in this document is subject to legal disclaimers.
9
1/2 e
10
12.1
12.0
11.9
REFERENCES
E
0
11
12
Rev. 0.16 — 27 May 2010
b
0.8
13
e
14
10.4
JEITA
e
1
1/2 e
scale
B
e
5
∅ w
∅ v
10.4
e
e
A
E
2
2
M
M
C
C
0.15
v
A
B
A
10 mm
0.05
w
A
2
0.08
A
y
1
y
1
C
0.1
y
detail X
1
PROJECTION
EUROPEAN
LPC3141/3143
C
X
y
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
08-05-30
08-07-09
SOT570-3
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