HD64F2612FA20 Renesas Electronics America, HD64F2612FA20 Datasheet - Page 34

• Manufacturer Part Number: HD64F2612FA20
• Description: IC H8S MCU FLASH 128K 80QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2612FA20

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: CAN, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 43
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 80-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Table 14.5
Table 14.6
Table 14.7
Table 14.8
Table 14.9
Table 14.10 Serial Transfer Formats (Asynchronous Mode) ...................................................... 339
Table 14.11 SSR Status Flags and Receive Data Handling......................................................... 346
Table 14.12 SCI Interrupt Sources .............................................................................................. 375
Table 14.13 SCI Interrupt Sources .............................................................................................. 376
Section 15 Controller Area Network (HCAN)
Table 15.1
Table 15.2
Table 15.3
Table 15.4
Table 15.5
Section 16 A/D Converter
Table 16.1
Table 16.2
Table 16.3
Table 16.4
Table 16.5
Table 16.6
Section 18 ROM
Table 18.1
Table 18.2
Table 18.3
Table 18.4
Table 18.5
Table 18.6
Table 18.7
Section 19 Clock Pulse Generator
Table 19.1
Table 19.2
Table 19.3
Rev. 7.00 Sep. 11, 2009 Page xxxii of xxxiv
REJ09B0211-0700
Maximum Bit Rate with External Clock Input (Asynchronous Mode)................... 335
BRR Settings for Various Bit Rates (Clocked Synchronous Mode) ....................... 336
Maximum Bit Rate with External Clock Input (Clocked Synchronous Mode)....... 336
Examples of Bit Rate for Various BRR Settings (Smart Card Interface Mode)
(When n = 0 and S = 372) ....................................................................................... 337
Maximum Bit Rate at Various Frequencies (Smart Card Interface Mode)
(When S = 372) ....................................................................................................... 337
HCAN Pins.............................................................................................................. 385
Limits for Settable Value ........................................................................................ 415
Setting Range for TSEG1 and TSEG2 in BCR ....................................................... 416
HCAN Interrupt Sources ......................................................................................... 428
Interval Limitation between TXPR and TXPR or between TXPR and TXCR ....... 433
Pin Configuration .................................................................................................... 437
Analog Input Channels and Corresponding ADDR Registers................................. 439
A/D Conversion Time (Single Mode) ..................................................................... 444
A/D Conversion Time (Scan Mode)........................................................................ 444
A/D Converter Interrupt Source .............................................................................. 445
Analog Pin Specifications ....................................................................................... 450
Differences between Boot Mode and User Program Mode..................................... 455
Pin Configuration .................................................................................................... 459
Setting On-Board Programming Modes.................................................................. 463
Boot Mode Operation.............................................................................................. 465
System Clock Frequencies for Which Automatic Adjustment of LSI Bit Rate Is
Possible ................................................................................................................... 465
Flash Memory Operating States .............................................................................. 475
Registers Present in F-ZTAT Version but Absent in Mask ROM Version ............. 476
Damping Resistance Value ..................................................................................... 480
Crystal Resonator Characteristics............................................................................ 481
External Clock Input Conditions ............................................................................. 482