HD64F2612FA20 Renesas Electronics America, HD64F2612FA20 Datasheet - Page 35
![IC H8S MCU FLASH 128K 80QFP](/photos/12/41/124149/hd64f2612fa20_sml.jpg)
HD64F2612FA20
Manufacturer Part Number
HD64F2612FA20
Description
IC H8S MCU FLASH 128K 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Specifications of HD64F2612FA20
Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
43
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2612FA20
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
HD64F2612FA20J
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
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Section 20 Power-Down Modes
Table 20.1
Table 20.2
Table 20.3
Table 20.4
Section 21 Electrical Characteristics
Table 21.1
Table 21.2
Table 21.3
Table 21.4
Table 21.5
Table 21.6
Table 21.7
Table 21.8
Low Power Dissipation Mode Transition Conditions ............................................. 487
LSI Internal States in Each Mode............................................................................ 489
Oscillation Stabilization Time Settings ................................................................... 497
φ Pin State in Each Processing State ....................................................................... 501
Absolute Maximum Ratings.................................................................................... 503
DC Characteristics................................................................................................... 504
Permissible Output Currents ................................................................................... 507
Clock Timing........................................................................................................... 508
Control Signal Timing............................................................................................. 509
Timing of On-Chip Supporting Modules ................................................................ 511
A/D Conversion Characteristics .............................................................................. 516
Flash Memory Characteristics................................................................................. 517
Rev. 7.00 Sep. 11, 2009 Page xxxiii of xxxiv
REJ09B0211-0700
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