DF2265TE13V Renesas Electronics America, DF2265TE13V Datasheet - Page 66

IC H8S/2265 MCU FLASH 100TQFP

DF2265TE13V

Manufacturer Part Number
DF2265TE13V
Description
IC H8S/2265 MCU FLASH 100TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of DF2265TE13V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2265TE13V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 2 CPU
• Two CPU operating modes
• Power-down state
Note: * Normal mode is not available in this LSI.
2.1.1
The differences between the H8S/2600 CPU and the H8S/2000 CPU are shown below.
• Register configuration
• Basic instructions
• The number of execution states of the MULXU and MULXS instructions;
In addition, there are differences in address space, CCR and EXR * register functions, and power-
down modes, etc., depending on the model.
Note: * Supported only by the H8S/2268 Group.
Rev. 5.00 Sep. 01, 2009 Page 14 of 656
REJ09B0071-0500
Instruction
MULXU
MULXS
⎯ 16 × 16-bit register-register multiply:
⎯ 32 ÷ 16-bit register-register divide:
⎯ Normal mode *
⎯ Advanced mode
⎯ Transition to power-down state by a SLEEP instruction
⎯ CPU clock speed selection
⎯ The MAC register is supported by the H8S/2600 CPU only.
⎯ The four instructions MAC, CLRMAC, LDMAC, and STMAC are supported by the
H8S/2600 CPU only.
Differences between H8S/2600 CPU and H8S/2000 CPU
Mnemonic
MULXU.B Rs, Rd
MULXU.W Rs, ERd
MULXS.B Rs, Rd
MULXS.W Rs, ERd
20 states
20 states
H8S/2600
3
4
4
5
Execution States
H8S/2000
12
20
13
21

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