DF2377RVFQ33 Renesas Electronics America, DF2377RVFQ33 Datasheet - Page 311

• Manufacturer Part Number: DF2377RVFQ33
• Description: IC H8S MCU FLASH 3V 384K 144LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2377RVFQ33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 6 Bus Controller (BSC)
When DDS = 0 or EDDS = 0: When continuous synchronous DRAM space is accessed in
DMAC or EXDMAC single address transfer mode, full access (normal access) is always
performed. With the synchronous DRAM interface, the DACK or EDACK output goes low from
the T
state.
r
In modes other than DMAC or EXDMAC single address transfer mode, burst access can be used
when accessing continuous synchronous DRAM space.
Figure 6.61 shows the DACK or EDACK output timing for connecting the synchronous DRAM
interface when DDS = 0 or EDDS = 0.
Rev.7.00 Mar. 18, 2009 page 243 of 1136
REJ09B0109-0700