DF2377RVFQ33 Renesas Electronics America, DF2377RVFQ33 Datasheet - Page 42

• Manufacturer Part Number: DF2377RVFQ33
• Description: IC H8S MCU FLASH 3V 384K 144LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2377RVFQ33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 24 Power-Down Modes ........................................................................ 965
24.1 Register Descriptions ......................................................................................................... 968
24.2 Operation............................................................................................................................ 972
24.3 φ Clock Output Control...................................................................................................... 979
24.4 Usage Notes ....................................................................................................................... 979
Section 25 List of Registers............................................................................... 981
25.1 Register Addresses (Address Order) .................................................................................. 981
25.2 Register Bits....................................................................................................................... 993
25.3 Register States in Each Operating Mode.......................................................................... 1007
Section 26 Electrical Characteristics ............................................................... 1019
26.1 Electrical Characteristics for H8S/2377, H8S/2375, H8S/2373, H8S/2377R,
26.2 Electrical Characteristics for H8S/2378........................................................................... 1035
Rev.7.00 Mar. 18, 2009 page xl of lxvi
REJ09B0109-0700
24.1.1 Standby Control Register (SBYCR) ..................................................................... 968
24.1.2 Module Stop Control Registers H and L (MSTPCRH, MSTPCRL)..................... 970
24.1.3 Extension Module Stop Control Registers H and L
24.2.1 Clock Division Mode............................................................................................ 972
24.2.2 Sleep Mode ........................................................................................................... 973
24.2.3 Software Standby Mode........................................................................................ 973
24.2.4 Hardware Standby Mode ...................................................................................... 976
24.2.5 Module Stop Mode ............................................................................................... 978
24.2.6 All-Module-Clocks-Stop Mode ............................................................................ 978
24.4.1 I/O Port Status....................................................................................................... 979
24.4.2 Current Dissipation during Oscillation Stabilization Standby Period ................... 979
24.4.3 EXDMAC, DMAC, and DTC Module Stop ......................................................... 980
24.4.4 On-Chip Peripheral Module Interrupts ................................................................. 980
24.4.5 Writing to MSTPCR, EXMSTPCR ...................................................................... 980
24.4.6 Notes on Clock Division Mode............................................................................. 980
H8S/2375R, and H8S/2373R ........................................................................................... 1019
26.1.1 Absolute Maximum Ratings ............................................................................... 1019
26.1.2 DC Characteristics .............................................................................................. 1020
26.1.3 AC Characteristics .............................................................................................. 1023
26.1.4 A/D Conversion Characteristics.......................................................................... 1032
26.1.5 D/A Conversion Characteristics.......................................................................... 1032
26.1.6 Flash Memory Characteristics ............................................................................ 1033
26.1.7 Usage Note.......................................................................................................... 1034
26.2.1 Absolute Maximum Ratings ............................................................................... 1035
26.2.2 DC Characteristics .............................................................................................. 1036
(EXMSTPCRH, EXMSTPCRL) .......................................................................... 971