MC56F8323VFB60 Freescale Semiconductor, MC56F8323VFB60 Datasheet - Page 2

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MC56F8323VFB60

Manufacturer Part Number
MC56F8323VFB60
Description
IC MPU HYBRID DSP 32K 64-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheet

Specifications of MC56F8323VFB60

Core Processor
56800
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
27
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
64-LQFP
For Use With
MC56F8323EVME - BOARD EVALUATION MC56F8323
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC56F8323VFB60
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
2
Rev 1.0
Rev 2.0
Rev 3.0
Rev 4.0
Rev 5.0
Rev 6.0
Rev 7.0
Rev 8.0
Rev 9.0
Rev 10.0
Rev. 11.0
Rev 12.0
Rev 13.0
Version History
Pre-Release version, Alpha customers only
Initial Public Release
Corrected typo in
issues.
Added Package Pins to GPIO Table in Section 8. Removed reference to pin group 9 in
Replacing TBD Typical Min with values in
language throughout family. Updated values in Regulator Parameters,
Operation Timing Requirements
Table
Updated values in Power-On Reset Low Voltage,
Correcting package pin numbers in
from 37 to 51, Index0 changed from 36 to 50, and Home0 changed from 35 to 49. All pin changes in
Table 2-2 were do to data entry errors - This package pin-out has not changed
Added
Interrupt in
Table
Updated numbers in
Pd characteristics.
Replace any reference to Flash Interface Unit with Flash Memory Module; changed example in
2.2; added note on V
Table
Table
Table 10-24
Clarification to
Table
Added 56F8123 information; edited to indicate differences in 56F8323 and 56F8123.Reformatted for
Freescale look and feel. Updated Temperature Sensor and ADC tables, then updated balance of
electrical tables for consistency throughout the family. Clarified I/O power description in
added note to
Added output voltage maximum value and note to clarify in
expectancy note, since life expectancy is dependent on customer usage and must be determined by
reliability engineering. Clarified value and unit measure for Maximum allowed P
Corrected note about average value for Flash Data Retention in
RoHS-compliant orderable part numbers in
Deleted formula for Max Ambient Operating Temperature (Automotive) and Max Ambient Operating
Temperature (Industrial) in
cover.
10-24, and IO Loading Coefficients at 10MHz,
10-6.
2-2; corrected typo FIVAL1 and FIVAH1 in
10-12; corrected temperature range in
10-5. Removed text and Table 10-2; replaced with note to
Part
Table
4.8, added addition text to
and new graphs in
Table 10-7
Table
Table
4-3, removed min and max numbers; only documenting Typ. numbers for LVI in
Document Revision History
Table 10-7
REFH
10-23, corrected Digital Input Current Low (pull-up enabled) numbers in
56F8323 Technical Data, Rev. 17
10-4, Flash Endurance is 10,000 cycles. Addressed additional grammar
and clarified
and V
Table
Figure
and
REFLO
Table
10-4. Added RoHS-compliance and “pb-free” language to back
Table
Table 10-8
Part 6.9
Section 12.3
Description of Change
in
10-13, SPI Timing,
10-21.
Table 2-2
Table
2-2, PhaseA0 changed from 38 to 52, PhaseB0 changed
Table
Table
on POR reset, added the word “access” to FM Error
with more recent data. Corrected typo in
10-17. Editing grammar, spelling, consistency of
Table
Table
13-1.
10-14; added ADC calibration information to
and
.
Table
4-12; removed unneccessary notes in
10-6.
Table
Table
Table
10-25.
11-1; added note to Vcap pin in
Table
Table
10-18, ADC Parameters,
10-1; also removed overall life
Table
10-4. Added new
10-1.
Freescale Semiconductor
10-9, External Clock
D
in
Table
Table
Table
Table 10-3
10-3.
Preliminary
10-5.
2-2,
Part
in

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