IAR-KSK-IMX25 Freescale Semiconductor, IAR-KSK-IMX25 Datasheet - Page 125
IAR-KSK-IMX25
Manufacturer Part Number
IAR-KSK-IMX25
Description
KIT DEVELOPMENT I.MX257, ARM926
Manufacturer
Freescale Semiconductor
Series
i.MX25r
Type
MCUr
Datasheets
1.MCIMX25WPDKJ.pdf
(2 pages)
2.IAR-KSK-IMX25.pdf
(154 pages)
3.IAR-KSK-IMX25.pdf
(2 pages)
4.IAR-KSK-IMX25.pdf
(57 pages)
Specifications of IAR-KSK-IMX25
Contents
Board, Cables, CD, Debugger, Power Supply
Processor To Be Evaluated
I.MX257
Processor Series
i.MX25
Data Bus Width
16 bit
Interface Type
UART, JTAG, USB, Ethernet, SD/MMC
Core
ARM926EJ-S
Silicon Manufacturer
Freescale
Core Architecture
ARM
Core Sub-architecture
ARM9
Silicon Core Number
I.MX2
Silicon Family Name
I.MX25
Mcu Supported Families
I.MX25
For Use With/related Products
i.MX25
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- MCIMX25WPDKJ PDF datasheet
- IAR-KSK-IMX25 PDF datasheet #2
- IAR-KSK-IMX25 PDF datasheet #3
- IAR-KSK-IMX25 PDF datasheet #4
- Current page: 125 of 154
- Download datasheet (2Mb)
4.2
Table 100
Freescale Semiconductor
•
•
•
Contact Name
NGND_ADC
MPLL_GND
FUSE_VDD
MPLL_VDD
Maximum solder bump diameter measured parallel to datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder bumps.
Parallelism measurement shall exclude any effect of mark on top surface of package.
BATT_VDD
Table 100. 17×17 mm Package Ground, Power Sense, and Reference Contact Assignments
Ground, Power, Sense, and Reference Contact Assignments
Case 17x17 mm, 0.8 mm Pitch
shows the 17×17 mm package ground, power, sense, and reference contact assignments.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
P10
T17
U17
U18
Y13
Figure 98.
zzxz
17×17 i.MX25 Production Package
Contact Assignment
125
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