XQ2V1000-4BG575N Xilinx Inc, XQ2V1000-4BG575N Datasheet - Page 6
XQ2V1000-4BG575N
Manufacturer Part Number
XQ2V1000-4BG575N
Description
FPGA 650MHZ CMOS1.5V 575-P
Manufacturer
Xilinx Inc
Series
QPro™ Virtex™-IIr
Datasheet
1.XQ2V1000-4BG575N.pdf
(134 pages)
Specifications of XQ2V1000-4BG575N
Number Of Labs/clbs
1280
Total Ram Bits
737280
Number Of I /o
328
Number Of Gates
100000
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
-55°C ~ 125°C
Package / Case
575-BBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Logic Elements/cells
-
Other names
Q5801737
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XQ2V1000-4BG575N
Manufacturer:
XILINX
Quantity:
325
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Virtex-II Device/Package Combinations and Maximum I/O
Wire-bond and flip-chip packages are available.
shows the maximum possible number of user I/Os in wire-
bond and flip-chip packages.
available user I/Os for all device/package combinations.
•
•
•
Table 4: Package Information
Table 5: Virtex-II Device/Package Combinations and Maximum Number of Available I/Os
DS122 (v2.0) December 21, 2007
Product Specification
Notes:
1.
2.
Pitch (mm)
Size (mm)
FG denotes wire-bond fine-pitch plastic BGA (1.00 mm
pitch).
BG denotes wire-bond standard plastic BGA (1.27 mm
pitch).
CG denotes wire-bond fine-pitch hermetic ceramic
column grid array (1.27 mm pitch).
Package
The BG728 and CG717 packages are pinout (footprint) compatible.
The CF1144 is pinout (footprint) compatible with the FF1152.
Package
CF1144
EF1152
CG717
FG456
BG575
BG728
EF957
R
23 x 23
FG456
1.00
Table 5
31 x 31
BG575
shows the number of
XQ2V1000
1.27
324
328
–
–
–
–
–
Table 4
BG728 & CG717
www.xilinx.com
35 x 35
1.27
•
•
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, and RSVD) and VBATT.
CF denotes flip-chip fine-pitch non-hermetic ceramic
column grid Array (1.00 mm pitch).
EF denotes epoxy-coated flip-chip BGA package
(1.00 mm pitch).
Available I/Os
XQ2V3000
516
516
–
–
–
–
–
40 x 40
EF957
1.27
QPro Virtex-II 1.5V Platform FPGAs
CF1144
35 x 35
1.00
XQ2V6000
684
824
824
–
–
–
–
EF1152
35 x 35
1.00
6
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