XQ2V1000-4BG575N Xilinx Inc, XQ2V1000-4BG575N Datasheet - Page 76

• Manufacturer Part Number: XQ2V1000-4BG575N
• Description: FPGA 650MHZ CMOS1.5V 575-P
• Manufacturer: Xilinx Inc
• Series: QPro™ Virtex™-IIr

Specifications of XQ2V1000-4BG575N

• Number Of Labs/clbs: 1280
• Total Ram Bits: 737280
• Number Of I /o: 328
• Number Of Gates: 100000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 575-BBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Logic Elements/cells: -
• Other names: Q5801737

QPro Virtex-II Device/Package Combinations and Maximum I/Os Available
This section provides
Combinations and Maximum I/Os Available"
Virtex-II Pin
following packages:
•
•
•
•
•
•
QPro Virtex-II devices are available in both wire-bond and
flip-chip packages. The basic package dimensions are
listed in
more complete mechanical description of each available
Table 69: Package Information
Table 70: QPro Virtex-II Device/Package Combinations and Maximum Number of Available I/Os (Advance Information)
DS122 (v2.0) December 21, 2007
Product Specification
Notes:
1.
Pitch (mm)
Size (mm)
Package
"FG456 Fine-Pitch BGA Package"
"BG575 Standard BGA Package"
"BG728 Standard BGA and CG717 Ceramic CGA
Packages"
"EF957 Epoxy-Coated Flip-Chip BGA Package"
"EF957 Epoxy-Coated Flip-Chip BGA Package"
"EF1152 Epoxy-Coated Flip-Chip BGA Package
Specifications (1.00 mm pitch)"
The BG728 and CG717 packages are pinout (footprint) compatible.
Table
Package
CF1144
EF1152
BG575
BG728
CG717
R
FG456
EF957
Definitions", followed by pinout tables for the
69. See
23 x 23
FG456
1.00
"QPro Virtex-II Device/Package
Figure 51
31 x 31
BG575
through
1.27
XQ2V1000
Figure 56
324
328
and
BG728 & CG717
–
–
–
–
–
"QPro
35 x 35
1.27
for a
www.xilinx.com
package.
possible for each available package. There are four
package type definitions:
•
•
•
•
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, AND RSVD).
FG denotes plastic wire-bond fine-pitch BGA (1.00 mm
pitch).
BG denotes plastic wire-bond ball grid array (1.27 mm
pitch).
CG denotes hermetic ceramic wire-bond column grid
array (1.27 mm pitch).
CF denotes non-hermetic ceramic flip-chip column grid
array (1.00 mm pitch).
CF1144
35 x 35
Available I/Os
1.00
XQ2V3000
Table 70
516
516
684
720
–
–
–
shows the maximum number of user I/Os
QPro Virtex-II 1.5V Platform FPGAs
40 x 40
EF957
1.27
XQ2V6000
824
684
824
–
–
–
–
EF1152
35 x 35
1.00
76