MT47H32M16HR-3:F Micron Technology Inc, MT47H32M16HR-3:F Datasheet - Page 2

IC DDR2 SDRAM 512MBIT 3NS 84FBGA

MT47H32M16HR-3:F

Manufacturer Part Number
MT47H32M16HR-3:F
Description
IC DDR2 SDRAM 512MBIT 3NS 84FBGA
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet

Specifications of MT47H32M16HR-3:F

Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
512M (32Mx16)
Speed
3ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
84-TFBGA
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
250mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1466

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT47H32M16HR-3:F
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT47H32M16HR-3:F
Manufacturer:
MICRON/美光
Quantity:
20 000
Company:
Part Number:
MT47H32M16HR-3:F
Quantity:
28 000
Part Number:
MT47H32M16HR-3:F(D9JLR)
Manufacturer:
TOSH
Quantity:
1 225
Part Number:
MT47H32M16HR-3:F(D9JLR)
Manufacturer:
MICRON
Quantity:
1 000
Part Number:
MT47H32M16HR-3:FTR
Manufacturer:
MICRON/镁光
Quantity:
20 000
Table 1: Key Timing Parameters
Table 2: Addressing
Figure 1: 512Mb DDR2 Part Numbers
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
Note:
Speed Grade
1. Not all speeds and configurations are available in all packages.
-187E
-25E
-37E
-25
-3E
-3
Package
Pb-free
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
Lead Solder
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
32 Meg x 4 x 4 banks
Configuration
128 Meg x 4
64 Meg x 8
32 Meg x 16
MT47H
A[11, 9:0] (2K)
128 Meg x 4
A[13:0] (16K)
Example Part Number: MT47H128M4HR-25E :G
BA[1:0] (4)
CL = 3
8K
400
400
400
400
400
400
Configuration
128M4
64M8
32M16
CL = 4
Package
533
533
533
667
533
533
HW
HR
CF
JN
Data Rate (MT/s)
2
-
16 Meg x 8 x 4 banks
-187E
Speed
-37E
-25E
-3E
-25
A[13:0] (16K)
-3
64 Meg x 8
A[9:0] (1K)
BA[1:0] (4)
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t CK = 3.75ns, CL = 4
t CK = 3ns, CL = 5
t CK = 3ns, CL = 4
t CK = 2.5ns, CL = 6
t CK = 2.5ns, CL = 5
t CK = 1.875ns, CL = 7
8K
CL = 5
Speed Grade
800
800
667
667
667
512Mb: x4, x8, x16 DDR2 SDRAM
n/a
AT
IT
L
Low power
Industrial temperature
Automotive temperature
Revision
:F/:G
:
Revision
CL = 6
1066
800
800
n/a
n/a
n/a
© 2004 Micron Technology, Inc. All rights reserved.
8 Meg x 16 x 4 banks
32 Meg x 16
A[12:0] (8K)
A[9:0] (1K)
BA[1:0] (4)
8K
t
RC (ns)
Features
54
55
55
54
55
55

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