MT47H32M16HR-3:F Micron Technology Inc, MT47H32M16HR-3:F Datasheet - Page 7

• Manufacturer Part Number: MT47H32M16HR-3:F
• Description: IC DDR2 SDRAM 512MBIT 3NS 84FBGA
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16HR-3:F

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 512M (32Mx16)
• Speed: 3ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 84-TFBGA
• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 250mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1466

512Mb: x4, x8, x16 DDR2 SDRAM
Features
Figure 51: Bank Read – Without Auto Precharge ............................................................................................. 98
Figure 52: Bank Read – with Auto Precharge ................................................................................................... 99
t
t
Figure 53: x4, x8 Data Output Timing –
DQSQ,
QH, and Data Valid Window ................................................. 100
t
t
Figure 54: x16 Data Output Timing –
DQSQ,
QH, and Data Valid Window ..................................................... 101
t
t
Figure 55: Data Output Timing –
AC and
DQSCK ......................................................................................... 102
Figure 56: Write Burst ................................................................................................................................... 104
Figure 57: Consecutive WRITE-to-WRITE ...................................................................................................... 105
Figure 58: Nonconsecutive WRITE-to-WRITE ................................................................................................ 105
Figure 59: WRITE Interrupted by WRITE ....................................................................................................... 106
Figure 60: WRITE-to-READ ........................................................................................................................... 107
Figure 61: WRITE-to-PRECHARGE ................................................................................................................ 108
Figure 62: Bank Write – Without Auto Precharge ............................................................................................ 109
Figure 63: Bank Write – with Auto Precharge ................................................................................................. 110
Figure 64: WRITE – DM Operation ................................................................................................................ 111
Figure 65: Data Input Timing ........................................................................................................................ 112
Figure 66: Refresh Mode ............................................................................................................................... 113
Figure 67: Self Refresh .................................................................................................................................. 115
Figure 68: Power-Down ................................................................................................................................ 117
Figure 69: READ-to-Power-Down or Self Refresh Entry .................................................................................. 119
Figure 70: READ with Auto Precharge-to-Power-Down or Self Refresh Entry .................................................. 119
Figure 71: WRITE-to-Power-Down or Self Refresh Entry ................................................................................ 120
Figure 72: WRITE with Auto Precharge-to-Power-Down or Self Refresh Entry ................................................. 120
Figure 73: REFRESH Command-to-Power-Down Entry ................................................................................. 121
Figure 74: ACTIVATE Command-to-Power-Down Entry ................................................................................ 121
Figure 75: PRECHARGE Command-to-Power-Down Entry ............................................................................ 122
Figure 76: LOAD MODE Command-to-Power-Down Entry ............................................................................ 122
Figure 77: Input Clock Frequency Change During Precharge Power-Down Mode ........................................... 123
Figure 78: RESET Function ........................................................................................................................... 125
Figure 79: ODT Timing for Entering and Exiting Power-Down Mode .............................................................. 127
Figure 80: Timing for MRS Command to ODT Update Delay .......................................................................... 128
Figure 81: ODT Timing for Active or Fast-Exit Power-Down Mode ................................................................. 128
Figure 82: ODT Timing for Slow-Exit or Precharge Power-Down Modes ......................................................... 129
Figure 83: ODT Turn-Off Timings When Entering Power-Down Mode ............................................................ 129
Figure 84: ODT Turn-On Timing When Entering Power-Down Mode ............................................................. 130
Figure 85: ODT Turn-Off Timing When Exiting Power-Down Mode ............................................................... 131
Figure 86: ODT Turn-On Timing When Exiting Power-Down Mode ................................................................ 132
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512MbDDR2.pdf - Rev. R 12/10 EN
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