MT47H32M16HR-3:F Micron Technology Inc, MT47H32M16HR-3:F Datasheet - Page 4

• Manufacturer Part Number: MT47H32M16HR-3:F
• Description: IC DDR2 SDRAM 512MBIT 3NS 84FBGA
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16HR-3:F

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 512M (32Mx16)
• Speed: 3ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 84-TFBGA
• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 250mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1466

Contents
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 14
Packaging ...................................................................................................................................................... 18
Electrical Specifications – Absolute Ratings ..................................................................................................... 21
Electrical Specifications – I
AC Timing Operating Specifications ................................................................................................................ 31
AC and DC Operating Conditions .................................................................................................................... 42
ODT DC Electrical Characteristics ................................................................................................................... 43
Input Electrical Characteristics and Operating Conditions ............................................................................... 44
Output Electrical Characteristics and Operating Conditions ............................................................................. 47
Output Driver Characteristics ......................................................................................................................... 49
Power and Ground Clamp Characteristics ....................................................................................................... 53
AC Overshoot/Undershoot Specification ......................................................................................................... 54
Input Slew Rate Derating ................................................................................................................................ 56
Commands .................................................................................................................................................... 69
Mode Register (MR) ........................................................................................................................................ 75
Extended Mode Register (EMR) ....................................................................................................................... 80
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
Industrial Temperature .............................................................................................................................. 10
Automotive Temperature ........................................................................................................................... 11
General Notes ............................................................................................................................................ 11
Package Dimensions .................................................................................................................................. 18
FBGA Package Capacitance ......................................................................................................................... 20
Temperature and Thermal Impedance ........................................................................................................ 21
I
I
Truth Tables ............................................................................................................................................... 69
DESELECT ................................................................................................................................................. 73
NO OPERATION (NOP) .............................................................................................................................. 74
LOAD MODE (LM) ..................................................................................................................................... 74
ACTIVATE .................................................................................................................................................. 74
READ ......................................................................................................................................................... 74
WRITE ....................................................................................................................................................... 74
PRECHARGE .............................................................................................................................................. 75
REFRESH ................................................................................................................................................... 75
SELF REFRESH ........................................................................................................................................... 75
Burst Length .............................................................................................................................................. 76
Burst Type ................................................................................................................................................. 77
Operating Mode ......................................................................................................................................... 77
DLL RESET ................................................................................................................................................. 77
Write Recovery ........................................................................................................................................... 78
Power-Down Mode .................................................................................................................................... 78
CAS Latency (CL) ........................................................................................................................................ 79
DLL Enable/Disable ................................................................................................................................... 81
Output Drive Strength ................................................................................................................................ 81
DQS# Enable/Disable ................................................................................................................................. 81
RDQS Enable/Disable ................................................................................................................................. 81
Output Enable/Disable ............................................................................................................................... 81
On-Die Termination (ODT) ........................................................................................................................ 82
DD
DD7
Specifications and Conditions ............................................................................................................... 24
Conditions .......................................................................................................................................... 24
DD
Parameters ........................................................................................................ 24
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
© 2004 Micron Technology, Inc. All rights reserved.
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