MT46H8M32LFB5-6 IT:H Micron Technology Inc, MT46H8M32LFB5-6 IT:H Datasheet - Page 15

• Manufacturer Part Number: MT46H8M32LFB5-6 IT:H
• Description: DRAM Chip DDR SDRAM 256M-Bit 8Mx32 1.8V 90-Pin VFBGA Tray
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H8M32LFB5-6 IT:H

• Density: 256 Mb
• Maximum Clock Rate: 166 MHz
• Package: 90VFBGA
• Address Bus Width: 14 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 6.5|5 ns
• Operating Temperature: -40 to 85 °C
• Organization: 8Mx32
• Address Bus: 14b
• Access Time (max): 6.5/5ns
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 120mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Package Dimensions
Figure 6: 60-Ball VFBGA (8mm x 9mm)
PDF: 09005aef834bf85b
256mb_mobile_ddr_sdram_t36n.pdf - Rev. H 11/09 EN
Solder ball material:
SAC105 (98.5% Sn,
1% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.4 SMD ball pads.
60X Ø0.45
Seating
plane
7.2 CTR
0.1 A
0.8 TYP
Note:
A
9
1. All dimensions are in millimeters.
8
7
0.8 TYP
6.4 CTR
8 ±0.1
3
2
1
0.65 ±0.05
A
B
C
D
E
F
G
H
J
K
15
9 ±0.1
256Mb: x16, x32 Mobile LPDDR SDRAM
Ball A1 ID
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.0 MAX
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID