MT46H8M32LFB5-6 IT:H Micron Technology Inc, MT46H8M32LFB5-6 IT:H Datasheet - Page 2

DRAM Chip DDR SDRAM 256M-Bit 8Mx32 1.8V 90-Pin VFBGA Tray

MT46H8M32LFB5-6 IT:H

Manufacturer Part Number
MT46H8M32LFB5-6 IT:H
Description
DRAM Chip DDR SDRAM 256M-Bit 8Mx32 1.8V 90-Pin VFBGA Tray
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet

Specifications of MT46H8M32LFB5-6 IT:H

Density
256 Mb
Maximum Clock Rate
166 MHz
Package
90VFBGA
Address Bus Width
14 Bit
Operating Supply Voltage
1.8 V
Maximum Random Access Time
6.5|5 ns
Operating Temperature
-40 to 85 °C
Organization
8Mx32
Address Bus
14b
Access Time (max)
6.5/5ns
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
120mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
Figure 1: 256Mb Mobile LPDDR Part Numbering
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at www.micron.com/decoder.
PDF: 09005aef834bf85b
256mb_mobile_ddr_sdram_t36n.pdf - Rev. H 11/09 EN
Micron Technology
Product family
46 = Mobile DDR SDRAM
Operating voltage
H = 1.8V/1.8V
Configuration
16 Meg x 16
8 Meg x 32
Addressing
LF = Mobile standard addressing
LG = Reduced page-size addressing
MT 46
H
16M16 LF BF
2
256Mb: x16, x32 Mobile LPDDR SDRAM
-6
Micron Technology, Inc. reserves the right to change products or specifications without notice.
IT
:H
Revision
:H
Operating temperature
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
Cycle time
-5 = 5ns
-54 = 5.4ns
-6 = 6ns
-75 = 7.5ns
Package codes
BF = 8mm x 9mm VFBGA “green”
B5 = 8mm x 13mm VFBGA “green”
t
t
CK, CL = 3
CK, CL = 3
©2008 Micron Technology, Inc. All rights reserved.
t
t
CK, CL = 3
CK, CL = 3
Features

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