HFIXF1110CC.B2 Q E000 Intel, HFIXF1110CC.B2 Q E000 Datasheet - Page 179

• Manufacturer Part Number: HFIXF1110CC.B2 Q E000
• Manufacturer: Intel

Specifications of HFIXF1110CC.B2 Q E000

• Number Of Transceivers: 1
• Screening Level: Commercial
• Mounting: Surface Mount
• Operating Temperature (min): 0C
• Operating Temperature (max): 70C
• Lead Free Status / RoHS Status: Not Compliant

9.0
9.1
9.2
Datasheet
Mechanical Specifications
CBGA packages are suited for applications requiring high I/O counts and high electrical
performance. They are recommended for high-power applications, having high noise immunity
requirements.
Features
IXF1110 MAC Package Specifics
The IXF1110 MAC uses the following packaging (see
(CBGA) Package Specifications” on page
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Flip chip die attach; surface mount second-level interconnect
High electrical performance
High I/O counts
Area array I/O options
Multiple power zone offering supports core and four additional voltages
JEDEC-compliant package
576-ball BGA package with 6 balls removed diagonally from each corner, for a total of 552
balls used measuring 25 mm x 25 mm
Ball pitch of 1.0 mm
Overall package dimensions of 25 mm x 25 mm
Intel
®
IXF1110 10-Port 1000 Mbps Ethernet Media Access Controller
Order Number: 250210, Revision: 009
Intel
®
IXF1110 10-Port 1000 Mbps Ethernet Media Access Controller
181):
Figure 45, “552-Ceramic Ball Grid Array
07-Oct-2005
179