MT29C4G48MAZAPAKD-5 IT Micron Technology Inc, MT29C4G48MAZAPAKD-5 IT Datasheet - Page 21

• Manufacturer Part Number: MT29C4G48MAZAPAKD-5 IT
• Description: MICMT29C4G48MAZAPAKD-5_IT 4G+2G MCP
• Manufacturer: Micron Technology Inc

Figure 8: 168-Ball WFBGA (Package Code: KQ)
PDF: 09005aef83ba4387
168ball_nand_lpddr_j42p_j4z2_j4z3_omap.pdf – Rev. H 3/11
Solder ball
material: SAC105.
Dimensions apply
to solder balls post-
reflow on Ø0.28
SMD ball pads.
168X Ø0.34
Seating
plane
0.08 A
11 CTR
0.5 TYP
A
23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Note:
1. All dimensions are in millimeters.
12 ±0.1
11 CTR
Ball A1 ID
0.5 TYP
168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP
0.43 ±0.05
21
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
12 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.23 MIN
0.75 MAX
Ball A1 ID
Package Dimensions
© 2009 Micron Technology, Inc. All rights reserved.