MPC8343VRAGDB Freescale Semiconductor, MPC8343VRAGDB Datasheet - Page 16

• Manufacturer Part Number: MPC8343VRAGDB
• Description: IC MPU POWERQUICC II 620-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8343VRAGDB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 400MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 620-PBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8349E-MITXE
• Maximum Clock Frequency: 400 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 400MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: BGA
• No. Of Pins: 620
• Rohs Compliant: Yes
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 400MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.2V
• Operating Supply Voltage (max): 1.26V
• Operating Supply Voltage (min): 1.14V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 620
• Package Type: BGA
• For Use With: CWH-PPC-8343N-VX - KIT EVAL SYSTEM QUICCSTART 8248CWH-PPC-8343N-VE - EVALUATION SYSTEM QUICC MPC8343E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

DDR and DDR2 SDRAM
Table 15
Table 16
6.2
This section provides the AC electrical characteristics for the DDR and DDR2 SDRAM interface.
6.2.1
Table 17
16
At recommended operating conditions with GV
Output low current (V
Notes:
1. GV
2. MV
3. V
4. Output leakage is measured with all outputs disabled, 0 V
Current draw for MV
Note:
1. The voltage regulator for MV
AC input low voltage
AC input high voltage
Input/output capacitance: DQ, DQS
Delta input/output capacitance: DQ, DQS
Note:
1. This parameter is sampled. GV
noise on MV
equal to MV
TT
DD
REF
is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
is expected to be within 50 mV of the DRAM GV
is expected to be equal to 0.5 × GV
provides the DDR capacitance when
provides the current draw characteristics for MV
provides the input AC timing specifications for the DDR2 SDRAM when GV
DDR and DDR2 SDRAM AC Electrical Characteristics
MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10
DDR and DDR2 SDRAM Input AC Timing Specifications
REF
REF
Parameter
. This rail should track variations in the DC level of MV
Table 17. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface
Parameter/Condition
Table 14. DDR SDRAM DC Electrical Characteristics for GV
may not exceed ±2% of the DC value.
REF
Parameter/Condition
OUT
= 0.35 V)
Table 15. DDR SDRAM Capacitance for GV
REF
Table 16. Current Draw Characteristics for MV
DD
must supply up to 500 μA current.
= 2.5 V ± 0.125 V, f = 1 MHz, T
DD
of 1.8 ± 5%.
DD
, and to track GV
Symbol
I
V
V
OL
IH
IL
GV
DD
DD
at all times.
≤
(typ) = 2.5 V.
V
Symbol
OUT
DD
MV
C
C
DIO
IO
Symbol
DC variations as measured at the receiver. Peak-to-peak
I
REF
A
≤
MVREF
REF
15.2
Min
= 25°C, V
GV
—
REF
+ 0.25
.
DD
.
.
DD
OUT
Min
—
6
(typ) = 2.5 V
Min
—
= GV
MV
REF
DD
DD
REF
Max
—
(typ) = 2.5 V
/2, V
—
– 0.25
Max
0.5
Max
500
8
OUT
Freescale Semiconductor
(peak-to-peak) = 0.2 V.
DD
Unit
mA
Unit
Unit
(typ) = 1.8 V.
pF
pF
μA
V
V
Notes
Notes
Note
—
—
—
1
1
1